IDEX Biometrics and TMC collaborate on biometric cards
05 June 2019 17:39 GMT

IDEX Biometrics, a provider of advanced fingerprint identification and authentication solutions, is pleased to announce that it is collaborating with Tongxin Microelectronics, a secure element vendor in China focusing on the smart card industry.

TMC and IDEX will work closely to create a compatible biometric smart card solution for end-customer implementation.

TMC provides secure elements, which are crucial components used by payment card integrators. To achieve compatibility between the secure element and biometric sensor, two critical components in a biometric payment card, both companies will integrate IDEX’s sensor with TMC’s secure element for dual-interface solutions. This solution will support both match in the biometric MCU and match in the secure element, thus providing a higher level of security. The integration involves joint creation of native code in the secure element to manage and control IDEX’s sensor in the operating system of the secure element.

Stan Swearingen, CEO of IDEX Biometrics comments: “The demand for biometric smart cards is growing thanks to their increased security and convenience for end users. Therefore, it is critical for card manufacturers that the biometric solutions are compatible with the secure element in the card, known as the EMV chip. IDEX is delighted to have joined forces with TMC to ensure complete compatibility of our solutions”

Yimin Ding, Vice President at TMC adds: “Through the rapid adoption of sensors in smart phones people have become accustomed to biometric authentication. It is a very logical next step to introduce this usability and security in payment cards. The combined solution, with our secure element and IDEX’s fingerprint sensor which enables matching in the secure element, creates a very compelling value proposition; a simple and secure turn-key solution for customers. This reduces complexity and cost for the card manufacturers. We are excited about working with IDEX’s leading technology to ensure compatibility with our solutions and look forward to seeing the market accelerate through 2019 and beyond.”

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